The TO-247 packaging stands as a prominent archetype of power semiconductor device packaging, conventionally fashioned from metallic or plastic materials. Its geometric configuration assumes a rectangular form with three pins allocated for circuit board connectivity. What distinguishes this packaging lies in its exceptional aptitude for heat dissipation, rendering it an optimal selection for high-power applications. The TO-247 packaging is adept at housing both power transistors and power diodes, rendering it pervasive across domains spanning power supplies, motor drives, inverters, and amplifiers. More information: https://www.smbom.com/news/12554